Holiday
ESS工科NE69 F2F3F4
此課程為半導體製程技術與原理的探討與介紹,可學習到半導體製程技術的演進、各製程步驟與製程設備的主要技術原理及重 要的基礎觀念,為從事積體電路製造、積體電路元件與積體電路設計的核心基礎課程,有助學員日後投入半導體、光電、微機 電與感測器等相關產業。
Course keywords: 半導體 Semiconductor, 熱製程 Thermal Process, 微影 Lithography, 薄膜沉積 Thin Film Deposition, 蝕刻 Etching, 製程整合 Process Integration. 一、課程說明(Course Description) 此課程為半導體製程技術與原理的探討與介紹,可學習到半導體製程技術的演進、各製程步驟與製 程設備的主要技術原理及重要的基礎觀念,為從事積體電路製造、積體電路元件與積體電路設計的 核心基礎課程,有助學員日後投入半導體、光電、微機電與感測器等相關產業,課程內容包含: * Introduction of IC Fabrication * Semiconductor Basics * Wafer Manufacturing and Epitaxy * Thermal Processes * Photolithography * Plasma Basics * Ion Implantation * Etch * CVD and Dielectric Thin Film * PVD and metallization * Process Integration 二、指定用書(Text Books) Hong Xiao, "Introduction to Semiconductor Manufacturing Technology", 2nd Edition, SPIE Press, Bellingham, Washington USA, 2012. 半導體製程技術導論(修訂二版, 蕭宏 原著), 全華圖書, 2014. 三、參考書籍(References) 1. M. Quirk and J. Serda, "Semiconductor Manufacturing Technology", Prentice Hall, New Jersey, USA, 2001. 2. IEDM short course. 3. S. M. Sze and M. K. Lee, "Semiconductor Devices Physics and Technology”, 3rd Edition, John Wiley & Sons, Inc., New York, USA, 2012. 4. James D. Plummer, M. D. Deal, and P. B. Griffin, "Silicon VLSI Technology: Fundamentals, Practice and Modeling”, Prentice Hall, New Jersey, USA, 2000. 5. 莊達人, "VLSI製造技術”, 高立圖書, 2002. 四、教學方式(Teaching Method) 綜合數本優良教科書的精華,適度補充IEDM會議所揭露的最新技術發展與趨勢,以power point編 撰上課講義,上課前將教材電子檔置於eLearn 數位學習平台供學生下載預習。 五、教學進度(Syllabus) 1. Introduction of IC Fabrication (3 hr) 2. Semiconductor Basics (3 hr) 3. Wafer Manufacturing and Epitaxy (3 hr) 4. Thermal Processes (6 hr) 5. Photolithography (6 hr) 6. Mid-term Exam. 7. Plasma Basics (3 hr) 8. Ion Implantation (3 hr) 9. Etch (6 hr) 10. CVD and Dielectric Thin Film (6 hr) 11. metallization (6hr) 12. Process Integration (3 hr) 13. Final Exam. 六、成績考核(Evaluation) Examination (Twice), Homework, Report, Interaction at class 七、可連結之網頁位址
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Average Percentage 82.64
Std. Deviation 11.76
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